VLK Techno Trade company logo
A panel of certificates
A telephone icon
Call Us At:
+66 2-124-3286
A mail icon
sales@vlk.th.com
cs1@vlk.th.com
A location icon
36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
Filter By

Showing results of items

Reset All
An arrow icon
Application
An arrow icon
Chemistry Base
An arrow icon
Cure Type
An arrow icon
Number of Components
An arrow icon
Physical Form
An arrow icon
Substrate / Material
LOCTITE® ABLESTIK ABP 8065T
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
Acrylic / Methacrylate
Attach / Potting
Heat Cure
LOCTITE® ABLESTIK ABP 8066T
LOCTITE® ABLESTIK ABP 8066T
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
Attach / Potting
Ceramics & Glass
Heat Cure
LOCTITE® ABLESTIK ABP 8068TA
LOCTITE® ABLESTIK ABP 8068TA
LOCTITE ABLESTIK ABP 8068TA, Semi-sintering, Semiconductor, Conductive adhesive
Attach / Potting
Epoxy
Heat Cure
Paste
LOCTITE® ABLESTIK ABP 8068TB
LOCTITE® ABLESTIK ABP 8068TB
A 1-part, rigid, semi-sintering die attach adhesive ideal for semiconductor packages requiring excellent thermal and electrical conductivity.
Attach / Potting
Heat Cure
Metals
Paste
Single Component
LOCTITE® ABLESTIK ABP 8142B
LOCTITE® ABLESTIK ABP 8142B
This silicone, low modulus, non-conductive die attach adhesive is designed for MEMs package applications.
Attach / Potting
Silicone
LOCTITE® ABLESTIK ABP 8151 D7
LOCTITE® ABLESTIK ABP 8151 D7
LOCTITE ABLESTIK ABP 8151D7, Silicone, Die Attach, Non-conductive Adhesive
Attach / Potting
Heat Cure
Silicone
LOCTITE® ABLESTIK ABP 84-3JT
LOCTITE® ABLESTIK ABP 84-3JT
LOCTITE ABLESTIK ABP 84-3JT, BMI Hybrid, Semiconductor, Die attach
Attach / Potting
Ceramics & Glass
Heat Cure
Metals
LOCTITE® ABLESTIK ABP 8415
LOCTITE® ABLESTIK ABP 8415
LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach
Attach / Potting
Ceramics & Glass
Epoxy
Heat Cure
LOCTITE® ABLESTIK ABP 8420
LOCTITE® ABLESTIK ABP 8420
This non-conductive die-attach adhesive is designed for cap and lid attach applications in wire bond packages.
Attach / Potting
Ceramics & Glass
Epoxy
Heat Cure
LOCTITE® ABLESTIK ABP 8910T
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
Attach / Potting
Heat Cure
Metals
Thank you! Your submission has been received!
Oops! Something went wrong while submitting the form.