LOCTITE® ABLESTIK ABP 8420
This non-conductive die-attach adhesive is designed for cap and lid attach applications in wire bond packages.
LOCTITE® ABLESTIK ABP 8420 is a non-conductive epoxy adhesive for cap and lid attach applications in wire bond packages. It’s typically used for optical sensors, lenses and 3D modules. It’s jettable with minimal resin bleed-out (RBO) and minimal adhesion drop post-reliability. A bondline thickness of >1 mm (0.04") must be maintained if used over an active die face to prevent die scarring. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection oven curing, it will cure at temperatures as low as 80ºC (176ºF).
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This non-conductive die-attach adhesive is designed for cap and lid attach applications in wire bond packages.
LOCTITE® ABLESTIK ABP 8420 is a non-conductive epoxy adhesive for cap and lid attach applications in wire bond packages. It’s typically used for optical sensors, lenses and 3D modules. It’s jettable with minimal resin bleed-out (RBO) and minimal adhesion drop post-reliability. A bondline thickness of >1 mm (0.04") must be maintained if used over an active die face to prevent die scarring. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection oven curing, it will cure at temperatures as low as 80ºC (176ºF).
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