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Call Us At:
+66 2-124-3286
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sales@vlk.th.com
cs1@vlk.th.com
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36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
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Substrate / Material
LOCTITE® ABLESTIK 970-1N1
LOCTITE® ABLESTIK 970-1N1
LOCTITE ABLESTIK 970-1N1, Epoxy, High Strength, General Assembly
Epoxy
Heat Cure
Metals
Single Component
LOCTITE® ABLESTIK A 304-6
LOCTITE® ABLESTIK A 304-6
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant
Epoxy
Heat Cure
Sealing
Single Component
LOCTITE® ABLESTIK A329-1
LOCTITE® ABLESTIK A329-1
LOCTITE ABLESTIK A329-1, Epoxy, Assembly
Ceramics & Glass
Epoxy
Heat Cure
Metals
Plastics
LOCTITE® ABLESTIK ABL 2100A
LOCTITE® ABLESTIK ABL 2100A
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
Attach / Potting
Ceramics & Glass
Heat Cure
LOCTITE® ABLESTIK ABL 2288A
LOCTITE® ABLESTIK ABL 2288A
LOCTITE ABLESTIK ABL 2288A, Proprietary Hybrid Chemistry, Die attach
Attach / Potting
Ceramics & Glass
Heat Cure
LOCTITE® ABLESTIK ABP 2030SCR
LOCTITE® ABLESTIK ABP 2030SCR
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.
Attach / Potting
Heat Cure
Single Component
LOCTITE® ABLESTIK ABP 2032S
LOCTITE® ABLESTIK ABP 2032S
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
Attach / Potting
Epoxy
Heat Cure
LOCTITE® ABLESTIK ABP 2035SCR
LOCTITE® ABLESTIK ABP 2035SCR
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
Attach / Potting
Ceramics & Glass
Heat Cure
LOCTITE® ABLESTIK ABP 2036SF
LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
Attach / Potting
Ceramics & Glass
Heat Cure
Paste
Single Component
LOCTITE® ABLESTIK ABP 2040LV
LOCTITE® ABLESTIK ABP 2040LV
LOCTITE ABLESTIK ABP 2040LV, Epoxy, Die Attach, Non-conductive Adhesive
Attach / Potting
Ceramics & Glass
Epoxy
Heat Cure
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