LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.

Description
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
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LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
LOCTITE® ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 2036SF is one-component silica based , non-conductive die attach adhesive with heat curing.

Description
LOCTITE® ABLESTIK ABP 2036SF has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.







