LOCTITE® ECCOBOND EN 3707F
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant

Description
LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
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LOCTITE® ECCOBOND EN 3707F
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
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LOCTITE® ECCOBOND EN 3707F
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
LOCTITE® ECCOBOND EN 3707F
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant

Description
LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.







