LOCTITE® ABLESTIK QMI536 is a white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including plastic ball grid arrays (PBGA), chip scale packages (CSP), array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bondline with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. It can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 100°C (212°F). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.

LOCTITE® ABLESTIK QMI536 is a white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including plastic ball grid arrays (PBGA), chip scale packages (CSP), array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bondline with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. It can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 100°C (212°F). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.