LOCTITE® ABLESTIK QMI519 is a silver, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It’s typically used for QFN, SOIC and SO package applications and is compatible with a wide variety of metals and ceramic surfaces, copper, silver, palladium and alloy 42. It’s designed to achieve higher UPHs than conventional oven cured adhesives. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater. Studies have also shown that parts cured on the die bonder have improved coplanarity. LOCTITE ABLESTIK QMI519 is formulated with a BMI acrylate-based resin and cures when exposed to heat.

LOCTITE® ABLESTIK QMI519 is a silver, thermally and electrically conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It’s typically used for QFN, SOIC and SO package applications and is compatible with a wide variety of metals and ceramic surfaces, copper, silver, palladium and alloy 42. It’s designed to achieve higher UPHs than conventional oven cured adhesives. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater. Studies have also shown that parts cured on the die bonder have improved coplanarity. LOCTITE ABLESTIK QMI519 is formulated with a BMI acrylate-based resin and cures when exposed to heat.