LOCTITE® ABLESTIK CE 3850 NS
LOCTITE ABLESTIK CE 3850, Electrically Conductive Adhesive, Circuit Assembly Applications
LOCTITE ABLESTIK CE3850 electrically conductive adhesive is designed for circuit assembly applications. It is specifically recommended for mounting low cost tin (Sn) and nickel (Ni) finished components onto conductive trace terminations of printed circuit boards or co-fined ceramic circuitry where it provides low and stable contact resistance . LOCTITE ABLESTIK CE3850 can be fast cured at 150ºC. It is ideal for application by needle dispense.
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Request Sourcing QuoteLOCTITE® ABLESTIK CE 3850 NS
LOCTITE ABLESTIK CE 3850, Electrically Conductive Adhesive, Circuit Assembly Applications
LOCTITE ABLESTIK CE3850 electrically conductive adhesive is designed for circuit assembly applications. It is specifically recommended for mounting low cost tin (Sn) and nickel (Ni) finished components onto conductive trace terminations of printed circuit boards or co-fined ceramic circuitry where it provides low and stable contact resistance . LOCTITE ABLESTIK CE3850 can be fast cured at 150ºC. It is ideal for application by needle dispense.
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