LOCTITE® ABLESTIK ABP 8037TI
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver, thermally and electrically conductive die-attach adhesive for attaching integrated circuits and components onto metal lead frames and advanced substrates. It's compatible with a wide array of metals and ceramic surfaces, silver-plated copper and pre-plated lead frames (NiPdAu) and exhibits high stability at high temperatures. It’s formulated with an acrylate-based resin and cures when exposed to heat.
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Request Sourcing QuoteLOCTITE® ABLESTIK ABP 8037TI
This acrylate-based and silver-filled, conductive die-attach adhesive paste is mainly used for attaching integrated circuits and components.
LOCTITE® ABLESTIK ABP 8037TI is a silver, thermally and electrically conductive die-attach adhesive for attaching integrated circuits and components onto metal lead frames and advanced substrates. It's compatible with a wide array of metals and ceramic surfaces, silver-plated copper and pre-plated lead frames (NiPdAu) and exhibits high stability at high temperatures. It’s formulated with an acrylate-based resin and cures when exposed to heat.
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