LOCTITE® ABLESTIK ABP 8035M
LOCTITE ABLESTIK ABP 8035M, Silicone Hydrosilylation, Semiconductor material, Die Attach Adhesive
LOCTITE® ABLESTIK ABP 8035M is a Non-conductive die attach adhesive designed for LED die attach applications. This silicone based product has unique properties including excellent worklife stability which ensure it can be used continuous for 24 hours pin-transfer test. Its low outgas ratio during cure and high adhesion strength, good thermal stability, high transparent ratio and high storage modulus properties after cure are important for LED applications. This adhesive can be cured in conventional box at 175°C for 1 hour. Please refer to the TDS for alternate cure schedules.
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Request Sourcing QuoteLOCTITE® ABLESTIK ABP 8035M
LOCTITE ABLESTIK ABP 8035M, Silicone Hydrosilylation, Semiconductor material, Die Attach Adhesive
LOCTITE® ABLESTIK ABP 8035M is a Non-conductive die attach adhesive designed for LED die attach applications. This silicone based product has unique properties including excellent worklife stability which ensure it can be used continuous for 24 hours pin-transfer test. Its low outgas ratio during cure and high adhesion strength, good thermal stability, high transparent ratio and high storage modulus properties after cure are important for LED applications. This adhesive can be cured in conventional box at 175°C for 1 hour. Please refer to the TDS for alternate cure schedules.
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