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LOCTITE® ABLESTIK 8380

LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive

Description

LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.

REQUEST A QUOTE
LOCTITE® ABLESTIK 8380
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
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Download Datasheet (PDF)
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REQUEST A QUOTE
LOCTITE® ABLESTIK 8380
LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download icon showing a downward arrow entering a tray or container.
Download Datasheet (PDF)

LOCTITE® ABLESTIK 8380

LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive

Description

LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.

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