LOCTITE® ABLESTIK 8175
LOCTITE ABLESTIK 8175 is a silver, epoxy adhesive material that is a solder replacement in microelectronic interconnect applications.
LOCTITE® ABLESTIK 8175 is an electrically and thermally conductive material that is a Pb-free alternative to solder. The stress absorbing material is heat curable and may be used with thick metallizations or traditional printed circuit board surfaces and is stencil or screen printable. This product meets MIL-STD-883, Method 5011 requirements.
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Request Sourcing QuoteLOCTITE® ABLESTIK 8175
LOCTITE ABLESTIK 8175 is a silver, epoxy adhesive material that is a solder replacement in microelectronic interconnect applications.
LOCTITE® ABLESTIK 8175 is an electrically and thermally conductive material that is a Pb-free alternative to solder. The stress absorbing material is heat curable and may be used with thick metallizations or traditional printed circuit board surfaces and is stencil or screen printable. This product meets MIL-STD-883, Method 5011 requirements.
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