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LOCTITE® ABLESTIK 24

This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.

Description

LOCTITE® ABLESTIK 24 is perfect for joining transparent materials, such as glass, and where a thin bondline is desired. It can withstand continuous exposure at temperatures as high as 90ºC (194ºF) and short-term exposures up to 120ºC (248ºF), and it forms resilient bonds between materials with mismatched CTE (coefficient of thermal expansion).

REQUEST A QUOTE
LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Icon of a downward arrow with a horizontal line beneath it, symbolizing a download action.
Download Datasheet (PDF)
REQUEST A QUOTE
LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download icon showing a downward arrow entering a tray or container.
Download Datasheet (PDF)

LOCTITE® ABLESTIK 24

This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.

Description

LOCTITE® ABLESTIK 24 is perfect for joining transparent materials, such as glass, and where a thin bondline is desired. It can withstand continuous exposure at temperatures as high as 90ºC (194ºF) and short-term exposures up to 120ºC (248ºF), and it forms resilient bonds between materials with mismatched CTE (coefficient of thermal expansion).

REQUEST A QUOTE

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