LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.

Description
LOCTITE® ABLESTIK 24 is perfect for joining transparent materials, such as glass, and where a thin bondline is desired. It can withstand continuous exposure at temperatures as high as 90ºC (194ºF) and short-term exposures up to 120ºC (248ºF), and it forms resilient bonds between materials with mismatched CTE (coefficient of thermal expansion).
REQUEST A QUOTE
LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
REQUEST A QUOTE
LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
LOCTITE® ABLESTIK 24
This non-electrically conductive water-clear adhesive is ideal for joining transparent materials. It creates a thin bondline and resilient bonds between materials with mismatched CTE.

Description
LOCTITE® ABLESTIK 24 is perfect for joining transparent materials, such as glass, and where a thin bondline is desired. It can withstand continuous exposure at temperatures as high as 90ºC (194ºF) and short-term exposures up to 120ºC (248ºF), and it forms resilient bonds between materials with mismatched CTE (coefficient of thermal expansion).







