Authorized Distributor in Thailand
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free plastic ball grid array (PBGA) and array BGA packaging.
Description
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
REQUEST A QUOTE
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free plastic ball grid array (PBGA) and array BGA packaging.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
REQUEST A QUOTE
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free plastic ball grid array (PBGA) and array BGA packaging.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
LOCTITE® ABLESTIK 2100A
This fast-cure die-attach adhesive is designed for Pb-free plastic ball grid array (PBGA) and array BGA packaging.
Description
LOCTITE® ABLESTIK 2100A is a silver die-attach adhesive for Pb-free PBGA and array BGA packaging, made to withstand 500°F (260°C) reflow. It’s designed with a proprietary hybrid chemistry technology, offers excellent dispensing characteristics and cures fast when exposed to heat. It exhibits high hot/wet adhesion, low stress and bleed and ultra-low moisture absorption.
