Authorized Distributor in Thailand
LOCTITE® ABLESTIK 2033SC
This 1-part, red, non-conductive die-attach adhesive is designed for high throughput smart card bonding applications.
Description
LOCTITE® ABLESTIK 2033SC is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for high-throughput smart card bonding applications. It’s compatible with various encapsulant chemistries. It has a long work life, exhibits minimal resin bleed-out (RBO), and cures fast when exposed to heat.
REQUEST A QUOTE
LOCTITE® ABLESTIK 2033SC
This 1-part, red, non-conductive die-attach adhesive is designed for high throughput smart card bonding applications.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
REQUEST A QUOTE
LOCTITE® ABLESTIK 2033SC
This 1-part, red, non-conductive die-attach adhesive is designed for high throughput smart card bonding applications.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
LOCTITE® ABLESTIK 2033SC
This 1-part, red, non-conductive die-attach adhesive is designed for high throughput smart card bonding applications.
Description
LOCTITE® ABLESTIK 2033SC is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for high-throughput smart card bonding applications. It’s compatible with various encapsulant chemistries. It has a long work life, exhibits minimal resin bleed-out (RBO), and cures fast when exposed to heat.
