LOCTITE® ABLESTIK 2030SC
A 1-part, flexible, hybrid-based die attach adhesive designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.

Description
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
REQUEST A QUOTE
LOCTITE® ABLESTIK 2030SC
A 1-part, flexible, hybrid-based die attach adhesive designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
REQUEST A QUOTE
LOCTITE® ABLESTIK 2030SC
A 1-part, flexible, hybrid-based die attach adhesive designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
Get pricing, availability, and lead time directly from VLK — authorized distributor in Thailand.
Authorized
Henkel
Distributor
Buffer Stock
Flexible Delivery
Temperature Controlled Storage
BOI Priviledged
DG Licensed
ISO9001
Download Datasheet (PDF)
LOCTITE® ABLESTIK 2030SC
A 1-part, flexible, hybrid-based die attach adhesive designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.

Description
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.







