LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in plastic ball grid array (PBGA), FlexBGA, and Stacking BGA package applications. It cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.

LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in plastic ball grid array (PBGA), FlexBGA, and Stacking BGA package applications. It cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.