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Call Us At:
+66 2 150-0247 to 51
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sales@vlk.th.com
cs1@vlk.th.com
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36/7 Moo 13, Bungkumploy Sub-District,
Lam Luk Ka District, Pathumthani 12150
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BERGQUIST® GAP PAD® TGP 5000
BERGQUIST® GAP PAD® TGP 5000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
5.0 – 7.9 W/M·k
BERGQUIST® GAP PAD® TGP 5000NT03
BERGQUIST® GAP PAD® TGP 5000NT03
BERGQUIST GAP PAD TGP 5000NT03, High Thermal Conductivity, “S-Class” softness and conformability, Fiberglass-reinforced, Gap Filling Material
Non-Curing / Pre-Cured
Single Component
< 0.5 Mm
GAP PAD
BERGQUIST® GAP PAD® TGP 6000ULM
BERGQUIST® GAP PAD® TGP 6000ULM
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
Silicone
Non-Curing / Pre-Cured
Single Component
5.0 – 7.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 7000ULM
BERGQUIST® GAP PAD® TGP 7000ULM
This high performance, thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 7.0 W/m-K and ultra low modulus (ULM).
Silicone
Non-Curing / Pre-Cured
Single Component
5.0 – 7.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 800VO
BERGQUIST® GAP PAD® TGP 800VO
BERGQUIST GAP PAD TGP 800VO is a silicone, cost-effective, thermally conductive gap pad.
Silicone
Non-Curing / Pre-Cured
Single Component
< 1.0 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP 800VOS
BERGQUIST® GAP PAD® TGP 800VOS
This silicone, thermally conductive gap pad has high conformability and is ideal for a wide range of applications.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
< 1.0 W/M·k
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
Non-Curing / Pre-Cured
Single Component
< 1.0 W/M·k
< 0.5 Mm
GAP PAD
BERGQUIST® GAP PAD® TGP A2600
BERGQUIST® GAP PAD® TGP A2600
BERGQUIST GAP PAD TGP A2600, Thermally Conductive, Filled-polymer Laminate, Electrically Isolating, Reinforced Gap Filling Material
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
< 0.5 Mm
BERGQUIST® GAP PAD® TGP EMI 4000
BERGQUIST® GAP PAD® TGP EMI 4000
This multifunctional, silicone-free gap pad combines thermal conductivity and electromagnetic radiation attenuation, for silicone sensitive applications.
Silicone-Free
Non-Curing / Pre-Cured
Single Component
GAP PAD
BERGQUIST® GAP PAD® TGP EMI1000
BERGQUIST® GAP PAD® TGP EMI1000
This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.
Silicone
Non-Curing / Pre-Cured
Single Component
Electrically Insulating
1.0 – 2.9 W/M·k
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